File:Filled vias.jpg
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Size of this preview: 678 × 599 pixels. Other resolutions: 272 × 240 pixels | 543 × 480 pixels | 869 × 768 pixels | 1,159 × 1,024 pixels | 2,317 × 2,048 pixels | 5,462 × 4,827 pixels.
Original file (5,462 × 4,827 pixels, file size: 6.21 MB, MIME type: image/jpeg)
Summary
| Description |
English: Filled vias on a circuit board. Filled (or capped) vias don't have a visible hole after processing. This type of via is mainly used for via-in-pad for BGA fanout and is rarely visible like this. The outline of the covered hole is barely visible in this picture. |
| Date | |
| Source | Own work |
| Author | Phiarc |
| Other versions |
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Licensing
I, the copyright holder of this work, hereby publish it under the following license:
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File history
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 01:19, 12 March 2023 | | 5,462 × 4,827 (6.21 MB) | commons>Phiarc | much clearer image reshot at native mag instead of pushing af-s60 to 2.5:1 (it's kinda remarkable it's sort of okay with that at all) |
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